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Gallium arsenide (GaAs) is used in the manufacture of devices such as microwave frequency integrated circuits, monolithic microwave integrated circuits, infrared light-emitting diodes, laser diodes, solar cells and optical windows. Handling and processing thin GaAs wafers is usually enabled by using a sapphire wafer as a carrier, which is expensive and need to be refurbished after using.
Plan Optik AG offers Glass Carriers for GaAs wafer processing with the following characteristics:
Those Carriers are available in diameters up to 300 mm and feature blank or patterned surfaces. They are compatible with most common thin wafer handling systems using temporary bonding with laser-, chemical-, or mechanical-release. Laser marking (alphanumerical or QR-code) can be added for traceability during processing.
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The carriers do have customized specifications. If you are interested in learning more about Glass Carriers for GaAs wafers make sure to get in touch with our engineers. In addition Plan Optik AG offers some immediately available carriers via its brand Wafer Universe. More information about glass carriers for GaAs wafer processing and how these carriers can be used in a custom thin wafer handling process is available from the company.
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