K. Lancki und M. Lancki Ingenieurbüro

Since 1981 involved in packaging- and interconnection technologies for microelectronic systems.

Products

• PCB manufacturing (flex, flex - rigid, multilayer)
• Substrate technologies (thickfilm Al2 O3, steel, Cu +IMS)
• Chip and Wire, Flip-Chip, SMD - Technologies
• mixed - signal - ASIC (semi- and full-custom)
• LED - Technology

Services

• Fast track service,  middle and high volume production
• MPW and Wafer Sercice
• Business Development