K. Lancki und M. Lancki Ingenieurbüro

Since 1981 involved in packaging- and interconnection technologies for microelectronic systems.

Products

  • PCB manufacturing (flex, flex - rigid, multilayer)
  • Substrate technologies (thickfilm Al2 O3, steel, Cu +IMS)
  • Chip and Wire, Flip-Chip, SMD - Technologies
  • mixed - signal - ASIC (semi- and full-custom)
  • LED - Technology

Services

  • Fast track service,  middle and high volume production
  • MPW and Wafer Sercice
  • Business Development

General Information

K. Lancki und M. Lancki Ingenieurbüro
IVAM member
Streitstrasse 32
D - 13587 Berlin
Germany
Founding Year: 1981

Contact

Marian Lancki
+49 30 335 23 76