PHIX B.V.

W3+ Fair 2022

Booth no. B18

PHIX offers assembly services and contract manufacturing for photonic integrated circuits (PICs) and MEMS. We build optoelectronic modules based on all major PIC technology platforms, such as Indium Phosphide, Silicon Photonics, Silicon Nitride, and Planar Lightwave Circuit. We specialize in chip-to-chip hybrid integration, coupling to fiber arrays, and interfacing of DC and RF electrical signals. By offering our knowledge already at the chip design stage, we ensure ease of scale-up for volume manufacturing. PHIX provides a one-stop-shop for PIC assembly, from design to volume production.

Leader in assembling Photonic Integrated Circuits (PICs) and electronics into a single package, both for prototyping and customized full-scale production runs. Our assembly services use innovative cutting edge technology supporting all major PIC platforms. We are specialized in hybrid integration of chip-to-chip and fiber-to-chip modules to capitalize on the explosively growing segment of photonics as breakthrough technology for more sustainable data processing, sensing and metrology solutions.

We'd like to connect with customers and development partners for designing & assembling PIC-enabled optoelectronic modules for applications in Telecom, Automotive (like LIDAR systems), Quantum, Industry 4.0, AR/VR, Medical, Space & Defense.

Products

• Customer-specific optoelectronic modules based on photonic integrated circuits, such as tunable lasers, quantum processors, and LIDAR units.
• Optical v-groove fiber arrays with optional spot size converters

Services

• Packaging of photonic integrated circuits in scalable volumes
• Contract manufacturing of production processes such as wafer dicing, die polishing, flip chip hybrid assembly, fiber attachment, wire bonding, and testing