Optiprint AG

COMPAMED 2019

Hall 8a, booth H19.1

Optiprint is pleased to introduce the following novelties at the Compamed 2019 (Hall 08a – stand H19.1):
• Flex- and flex-rigid PCB's
• Ultra-thin rigid multilayer PCB's for interposer applications (Chip-Packaging Solutions)
• Ultra-fine line structures line/space < 25µm
• Printed Circuit Boards with Ticer foil – thin film resistor technology or FaradFlex capacity foil
• DIG, EPIG or ISIG - alternative surface finishes to ENEPIG – These surface treatments are particularly suited for gold wire bonding

For further information please view: www.optiprint.ch
Optiprint AG, CH-9442 Berneck