Optiprint AG

COMPAMED 2019

Hall 8a, booth H19.1

Optiprint is pleased to introduce the following novelties at the Compamed 2019 (Hall 08a – stand H19.1):
• Flex- and flex-rigid PCB's
• Ultra-thin rigid multilayer PCB's for interposer applications (Chip-Packaging Solutions)
• Ultra-fine line structures line/space < 25µm
• Printed Circuit Boards with Ticer foil – thin film resistor technology or FaradFlex capacity foil
• DIG, EPIG or ISIG - alternative surface finishes to ENEPIG – These surface treatments are particularly suited for gold wire bonding

For further information please view: www.optiprint.ch
Optiprint AG, CH-9442 Berneck

Optiprint offers consultation, development and manufacture at its production facility in east Switzerland. This means that we can guarantee legendary Swiss quality and precision. Our printed circuit boards are delivered all over the world so, apart from the quality, the price must also be right.

Products

High frequency printed circuit boards Metal-core printed circuit boards Flexible and flex-rigid printed circuit boards Ultra-fine lines Oversized printed circuit boards