IVAM Microtechnology Network
Hall 8a, booth H19.3
Turck duotec develops and produces miniaturised electronic components such as LED lighting on ceramic substrates and overmolded sensor modules. By using the autoclavable overmolding technology electronic components are effectively protected from the effects of hot steam sterilization in an autoclave at 134 ° C and 2 bar water vapor pressure. The autoclavable overmolding technology allows precise and miniaturized packaging of sensors and other electronic assemblies using overmolding with plastics materials and thus permitting repeated applications for medical usages.duotec is one of the world's leading solution providers for innovative electronics, connectivity, E²MS (Electronics Engineering and Manufacturing Services) and ODM (Original Design Manufacturing). Locations are in Halver, Grünhain-Beierfeld, Delémont (CH) and Arteaga (MX). The companies involved also include ml&s manufacturing logistics & services GmbH & Co. KG Greifswald. The companies are certified to ISO 9001, EN ISO 13485, IATF16949 and ISO/IEC 17025, among others, and develop specific electronic solutions for automotive, energy, building automation, industry, medical technology, mobility, telecommunications and IT.
Core competencies in electronics manufacturing include SMT (Surface Mount Technology), CoB (Chip on Board) technology, thick-film hybrid technology, system assembly, cable assembly and device manufacturing. In addition, duotec has extensive expertise in electronics protection by means of painting, potting or coating. For sterile applications of medical devices, it also offers autoclavable overmolding with biocompatible hot melts, thermoplastics and thermosets.
Among other things, duotec fulfills the requirements of a comprehensive quality management system according to DIN EN ISO 13485. duotec offers autoclavable overmolding as well as miniaturization of electronics, molding in 3D and the production of housing parts for manufacturers of medical devices. Autoclavable overmolding offers particular advantages to medical devices that must be waterproof and sterilizable. Direct overmolding with biocompatible thermoplastics, hotmelt (hot melt adhesives) and/or thermosets places a homogeneous 3D plastic housing around the electronics. In this way, the injection molding process encapsulates the electronic board with the polymer. A degree of protection of IP68 is achieved, and more than 3,000 autoclaving cycles are possible. Overmolding provides complete protection against both mechanical impact and the ingress of chemicals in liquid and even gaseous form. The space requirement remains small. The thickness of the protective wall can be reduced locally to a thickness of less than 0.5 millimeters. Without the need for additional components such as O-rings or sealing compounds, media-tight integration of contact pins and Teflon cables can also be achieved.
Over the past decades, duotec has continuously expanded its expertise in the development and production of sensor solutions. The portfolio includes sensors of different application areas: Distance or position, force and pressure, acceleration, light intensity, temperature, humidity, chemical concentration of liquids, flow and level. The trend towards miniaturization of sensor elements and evaluation electronics continues, and duotec is taking this into account. The chip of a newly developed force sensor platform based on a silicon strain gauge is only 0.5 x 0.5 mm and thus the size of a pinhead. This miniaturized and media-resistant sensor with optimized power consumption is suitable for the realization of autonomous IoT sensors. Equally conceivable is its use in the harsh environments of mobile machines as well as in energy generation plants. The monitoring of filling quantities with simultaneous detection of collisions predestines it for use in intralogistics. duotec also offers a platform solution for wireless data transmission.
Research, Specification, Concept/Feasibility study, Simulation, Circuit design, Firm- and software development, Layout development, Mechanical development, Process development, Testing development, Qualification/certification, Quality and project management. Layout data transfer, COB, SMT, THT, Thick-film and hybrid process, Protection of electronics, System assembly, Product-specific test management, Service, etc.
